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Altera Intros 164-Pin Cyclone III FPGA Package
By
ChannelTimes Staff
International Desk, Mar 27, 2008
Altera Corporation today announced the availability of new 8x8 mm2 packaging (M164) for its family of 65-nm Cyclone III FPGAs, providing designers with the highest density FPGA per board area.
The new 8x8 mm2 164-pin package with up to 16K logic elements (LEs) extends the Cyclone III FPGA's high-density small-package offering that includes 14x14 mm2 256-pin (U256) and 17x17 mm2 484-pin (U484) packages. Each of these packages offers the highest amount of logic and I/Os for its footprint, allowing engineers to use FPGAs in new applications, such as handheld radios, satellite phones, I/O modules, and consumer displays.
"Many designers of high-volume applications need a solution that provides maximum functionality with the lowest power while using minimal board space," said Luanne Schirrmeister, director of marketing, low-cost products, Altera Corporation. "Our complete lineup of small packages allows designers with demanding space constraints to use the most advanced high-volume, low-power FPGA in the market."
Cyclone III devices deliver 5K to 120K LEs, up to 4 Mbits of memory and up to 288 digital signal processing (DSP) multipliers, the company said. Built on TSMC's 65-nm Low-Power (LP) process, the Cyclone III family includes devices that are qualified for commercial, industrial and extended temperatures.
Related Links
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