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Fujitsu Unveils Mobile WiMAX Chipsets
By
ChannelTimes Staff
Mumbai, Jun 26, 2008
Fujitsu Microelectronics has announced a new mobile WiMAX chipset, especially for mobile WiMAX devices like smart phones and PDAs. The sample shipment will start in August 2008.
The chipset includes a baseband LSI, MB86K22; an RF LSI, MB86K52; and a power management LSI, MB39C316. These 3 devices are essential to produce a competitive WiMAX module. The chipset was designed to fit in the 12x12mm WiMAX module.
The technology will be deployed in the US, Europe and Taiwan this year, and in Japan next year. The initial service will be provided through PC-based mobile broadband access, with simultaneous development of portable devices, smart phones and navigation systems.
The mature software stacks of the chipset have been proven in the previous generation product, and the power management schemes have been optimized at the system level.
Makoto Awaga, general manager (Mobile Solution Business Group) of Fujitsu Microelectronics (Japan) said, "This highly integrated WiMAX chipset features the low power, and small form factor essential to the development of attractive mobile WiMAX terminal products. Fujitsu Microelectronics has assumed a global leadership position in WiMAX business development, and we have been working with different module vendors to meet the market demand."
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please gave bref |
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- V. K. Shukla,
Signet Computer, Gorakhpur
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plzz send compleate brif |
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- V. K. Shukla,
Signet Computer, Gorakhpur
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